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Pho-Tronics is a domestic circuit board supplier. We offer quick quotes on double-sided to 24 layer boards for quick turn prototypes (3 Days) through standard lead-time (3-4 weeks) medium volume production. Choose from FR-4, BT, Polyimide or Rogers material. We offer HASL and immersion silver plating in house, and can contract any other finish you need. If you need high volume production we have a relationship with an offshore manufacturer that can meet your needs. Blind and buried vias, mixed material, sequential lam, we are your total solution for rigid PCBS.
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| Product Feature |
STANDARD |
ADVANCED |
EMERGING |
| Inner Layer Trace & Space 0.5 oz Copper |
0.004 |
0.003 |
0.0025 |
| Inner Layer Trace 1 oz Copper |
0.004 |
0.0035 |
0.003 |
| Inner Space 1 oz Copper |
0.004 |
0.0035 |
0.003 |
| Smallest Drilled Hole Size |
0.0138 |
0.01 |
0.008 |
| Pad Over Drill Size {drill hole to pad - Tagency} |
0.014 |
0.012 |
0.012 |
| Minimum Inner Layer Clearance over Drill Size |
0.020 |
0.016 |
0.014 |
| Max. Aspect Ratio on .010 Drilled Hole |
7:1 |
8:1 |
9:1 |
| Maximum Aspect Ratio |
7:1 |
8:1 |
10:1 |
| Plated Hole Size Tolerance {+/-mils} |
0.003 |
0.002 |
0.0015 |
| Soldermask Registration {+/-mils} |
0.003 |
0.002 |
0.002 |
| Soldermask Encroached Pads {drill+} {+/-mils} |
0.006 |
0.006 |
0.006 |
| Minimum Soldermask Dam |
0.003 |
0.003 |
0.0025 |
| Layer Count |
2 - 16 |
17 - 24 |
17 - 24 |
| Material Thickness - signal/signal {mils} |
0.005 |
0.004 |
0.003 |
| Material Thickness - plane/plane {mils} |
0.005 |
0.004 |
0.003 |
| Impedance Control - Single Ended {+/-} |
10% |
7% |
5% |
| Impedance Control - Edge Coupled Differ. {+/-} |
10% |
7% |
5% |
| Impedance Control - Broad sided Differ. {+/-} |
10% |
7% |
5% |
| Innerlayer Feature Size Control {0.5 oz copper} {+/-mils} |
0.0005 |
0.0005 |
0.0005 |
| Outer Layer Feature Size Control {+/-mils} |
0.001 |
0.001 |
0.001 |
| Board Thickness: Minimum .016 / Maximum .150 |
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| Materials |
| FR-4 130-170 Tg, Lead Free Compatible/RoHS compliant FR-4 |
YES |
YES |
YES |
| Rogers 4000 Series High Frequency Circuit Materials |
NO |
YES |
YES |
| BT (N5000 or equivalent) |
YES |
YES |
YES |
| GI - Polyimide |
NO |
YES |
YES |
| *ADDITIONAL MATERIALS AVAILBLE UPON REQUEST |
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| Surface Finishes |
| HASL, Electroless Nickel /Au, Immersion Silver |
YES |
YES |
YES |
| Immersion Tin, Electrolytic Ni/Au, Nickel, Immersion Tin, OSP, Pb Free HASL |
NO |
YES |
YES |
| Special Capabilities |
| Buried Via Cores {min. thickness mils} |
0.014 |
0.008 |
0.006 |
| Sequential Lamination |
YES |
YES |
YES |
| Mixed Dielectric Constructions {Ex:Rogers/FR-4} |
NO |
YES |
YES |
| Filled & Plated Via in Pad |
YES |
YES |
YES |
| Conductive/Non-Conductive Via Fill |
NO |
YES |
YES |
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